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EC3576-C
AI System on Module

EC3576-C system on module is powered by the Rockchip RK3576 processor, tailored for AIoT and industrial markets.

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Lightweight Industrial AI Edge Computer

High-Performance CPU
8nm octa-core, 4×A72+4×A53 @ 2.3 GHz
Hardware acceleration
Powerful AI NPU
6.0 TOPS INT8, multi-format support
Advanced Graphics
Mali-G52 MC3, 8K codec, triple display
Industrial grade component
豊富なインターフェース
PCIe, USB 3.2, CAN-FD, GMAC, MIPI
Outdoor durability icon
工業グレード
-40 °C ~ +85 °C, ultra-thin connector
  • Core Technical Specifications
    AI 6.0 TOPS INT8 NPU
    Cloud Platform Cloud parameter config, container management, firmware management
    接続性 2×GMAC, USB 3.2, CAN-FD, MIPI-CSI×5, UART×12
    CPU 4×A72 @ 2.3 GHz + 4×A53 @ 2.2 GHz
    Dimensions (W × D × H) 55 × 68 × 3 mm
    Display Interface HDMI/eDP/DSI/DP, triple independent display
    Industrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MC
    Memory / Storage 8 GB LPDDR4 / 256 GB UFS
    Operating Temperature -40 °C ~ +85 °C
    OS Android 14
    Remote Management InHand DeviceLive, HTTPS, SSH
    Video Codec 8K@30 fps decode, 4K@60 fps encode
  • Hardware Platform
    CPU 4 × ARM Cortex-A72 @ 2.3 GHz + 4 × ARM Cortex-A53 @ 2.2 GHz
    GPU ARM Mali-G52 MC3
    NPU 6.0 TOPS INT8, supports INT4/INT8/INT16/FP16/BF16/TF32
    RAM 8 GB LPDDR4
    ROM 256 GB UFS
    VPU Hard Encode: H.264, H.265, 4K@60 fps; Hard Decode: H.264, H.265, VP9, AV1, AVS2, 8K@30 fps or 4K@120 fps
  • Display Interface
    DP TX 1 × USB/DP combo, DisplayPort v1.4, up to 4K@120 Hz, supports MST, USB Type-C with DP Alt, HDCP v2.3/v1.3
    EBC 1 × E-ink EPD, 2560 × 1920 hard decoding, 16-bit data bus, up to 32-level grayscale
    HDMI/eDP TX 1 × HDMI v2.1 / eDP v1.3 (muxed), up to 4K@120 Hz; Supports CEC, ARC, HDCP v2.3/v1.4; eDP supports up to 3 displays with different content
    MIPI DSI 1 × MIPI DSI-2 TX, D-PHY v2.0 (4 lanes) or C-PHY v1.1 (3 trios), up to 2560 × 1600@60 Hz
    Parallel 1 × Parallel RGB/BT.656/BT.1120, up to 1920 × 1080@60 Hz
  • Camera Interface
    DVP 1 × 8/10/12/16-bit standard DVP, up to 150 MHz data input; Supports BT.601/BT.656/BT.1120
    MIPI-CSI 5 × CSI-2; 4 × 2-lane D-PHY v1.2 (2.5 Gbps/lane, combinable to 2 × 4-lane); 1 × 4-lane D-PHY v2.0 (4.5 Gbps/lane) or 3 C-PHY trios; Supports up to 5 cameras working together
  • Audio
    Digital Audio Codec 1; Supports 2 × DAC, 3 blending modes each; Supports I2S/PCM master/slave mode, 16-bit sampling rate; Supports volume control
    SAI ≤5; SAI 0/1 support 4 TX lanes + 4 RX lanes; SAI 2/3/4 support 1 TX lane + 1 RX lane; Supports I2S/TDM/PCM mode, sampling rate up to 192 kHz, 16~32 bits
  • 接続性
    CAN-FD ≤2, compliant with CAN and CAN-FD; Supports standard and extended frames; 8192-bit FIFO
    Ethernet ≤2 × GMAC, pinout by RGMII/RMII, 10/100/1000 Mbps
    I2C ≤9, 7-bit and 10-bit address modes; Standard mode 100 kbps, HS mode 400 kbps
    PWM ≤16, supports interrupt operation, capturing mode
    SDIO ≤2, SDIO v3.0, 4-bit
    SPI ≤5, master and slave mode, each supports two chip selections
    UART ≤12, 64-bit FIFO for TX/RX; Supports 5/6/7/8-bit serial transceiving, up to 4 Mbps; All 12 UARTs support flow control and RS485
    USB 2.0 OTG 2
    USB 3.2 2 (1 × Type-C supports DP Alt mode; 1 × combo high speed interface)
  • Power
    Input Power DC 5V
  • Mechanical
    Dimensions (W × D × H) 55 × 68 × 3 mm
    Mounting Holes 4 × φ3.5 mm
    Package Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
  • Environment
    Operating Temperature -40 °C ~ +85 °C
  • Operating System
    OS Android 14
    OS Flashing Method USB OTG
  • Data Acquisition Protocol (DSA)
    Electricity Protocol DLT645-2007, IEC101/104, DNP3.0
    Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPI
    Other Protocol BACnet, CNC
  • Maintenance and Management
    DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware management
    Log Supports local system logs, remote logs, important log power-off preservation
    Remote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.
    Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
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Standard package*

EC3576-C Development Board *1

* Standard package contents vary by standard order codes.

Optional accessories

Power Supply *1

Contact us directly to learn more about our packaging options.

DeviceLive

IoTデバイス管理プラットフォーム

Device management, remote monitoring, edge app management, and remote maintenance to help industrial enterprises build intelligent edge networks.

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Frequently Asked Questions

What does the EC3576-C offer?

The EC3576-C is an AI System on Module (SoM) built on the Rockchip RK3576J SoC, designed to be integrated onto a customer-designed carrier board for industrial and commercial edge AI applications. Key specs:

——
Compute4× Cortex-A72 @ 2.3 GHz + 4× Cortex-A53 @ 2.2 GHz; 6-TOPS NPU (INT4/INT8/INT16/FP16/BF16/TF32); ARM Mali-G52 MC3 GPU
Memory8 GB LPDDR4 RAM, 256 GB UFS storage
OSAndroid 14 (flashed via USB OTG)
DisplayUp to 3 simultaneous displays with different content via HDMI 2.1 / eDP 1.3 / MIPI DSI-2 / Parallel / DP 1.4 / EBC (e-ink)
Camera5× MIPI CSI-2 + 1× DVP
接続性2× GbE, USB 3.2, USB 2.0 OTG, CAN-FD, PCIe 2.1
Form factor4× 100-pin board-to-board connector (0.4 mm pitch, 1.5 mm combined height)
Power / tempDC 5 V; −40 to +85 °C industrial range

Target applications per the datasheet: edge computing, intelligent terminals, industrial control, HMI, multimedia interaction, visual AI. Compatible with InHand’s DSA data-acquisition framework and DeviceLive cloud platform once deployed.

The EC3576-C is a module, not a standalone device — it is intended to be integrated onto a customer-designed carrier board, via four 100-pin board-to-board connectors (0.4 mm pitch, 1.5 mm combined height). Power input is DC 5 V. OS flashing is performed via USB OTG.

The EC3576-C exposes the following interfaces to the carrier board:

  • Ethernet: up to 2× Gigabit (GMAC, RGMII/RMII)
  • USB: 2× USB 3.2 (1× Type-C with USB/DP Alt, 1× combo high-speed) and 2× USB 2.0 OTG
  • PCIe: PCIe 2.1
  • Camera: 5× MIPI CSI-2 + 1× DVP (8/10/12/16-bit)
  • Display: up to 3 simultaneous via HDMI 2.1, eDP 1.3, MIPI DSI-2, Parallel (RGB/BT.656/BT.1120), DP 1.4, EBC (e-ink, 32 grayscale)
  • Industrial / serial: up to 2× CAN-FD, 12× UART (all RS-485 capable), 5× SPI, 9× I²C, 2× SDIO 3.0, 16× PWM
  • Audio: up to 5× SAI/I²S + a digital audio codec (2× DAC)
EC3576-CEC3588-C
———
OSAndroid 14Linux
SoCRK3576JRK3588 (8 nm flagship)
CPU4× A72 + 4× A534× A76 + 4× A55
GPUMali-G52 MC3Mali-G610 MP4 (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)
NPU6 TOPS6 TOPS (triple-core)
RAM / Storage8 GB LPDDR4 / 256 GB UFS16 GB LPDDR4 / 64 GB eMMC
HDMI outputup to 4K@120 Hzup to 8K@60 Hz
HDMI input—HDMI 2.0 RX
PCIePCIe 2.1PCIe 3.0 (2 controllers, configurable to 1×4) + PCIe 2.0 (≤3)
Power inputDC 5 VDC 4 V
Operating temp−40 to +85 °C0 to +80 °C

Pick the EC3576-C when the application targets Android (HMI, kiosks, multimedia/display-driven workloads), needs the wider industrial temperature range, or wants more on-board storage. Pick the EC3588-C when the application targets Linux, requires higher CPU/GPU performance, 8K output, HDMI capture, or PCIe 3.0 expansion bandwidth.

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