EC3576-C
AI System on Module
EC3576-C system on module is powered by the Rockchip RK3576 processor, tailored for AIoT and industrial markets.
FOTO
Lightweight Industrial AI Edge Computer
High-Performance CPU
8nm octa-core, 4×A72+4×A53 @ 2.3 GHz
Powerful AI NPU
6.0 TOPS INT8, multi-format support
Advanced Graphics
Mali-G52 MC3, 8K codec, triple display
Umfangreiche Schnittstellen
PCIe, USB 3.2, CAN-FD, GMAC, MIPI
Industriequalität
-40 °C ~ +85 °C, ultra-thin connector
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Technische Kernspezifikationen
AI 6.0 TOPS INT8 NPUCloud Platform Cloud parameter config, container management, firmware managementKonnektivität 2×GMAC, USB 3.2, CAN-FD, MIPI-CSI×5, UART×12CPU 4×A72 @ 2.3 GHz + 4×A53 @ 2.2 GHzAbmessungen (B × T × H) 55 × 68 × 3 mmDisplay Interface HDMI/eDP/DSI/DP, triple independent displayIndustrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MCMemory / Storage 8 GB LPDDR4 / 256 GB UFSBetriebstemperatur -40 °C ~ +85 °CBetriebssystem Android 14Remote Management InHand DeviceLive, HTTPS, SSHVideo Codec 8K@30 fps decode, 4K@60 fps encode
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Hardware Platform
CPU 4 × ARM Cortex-A72 @ 2.3 GHz + 4 × ARM Cortex-A53 @ 2.2 GHzGPU ARM Mali-G52 MC3NPU 6.0 TOPS INT8, supports INT4/INT8/INT16/FP16/BF16/TF32RAM 8 GB LPDDR4ROM 256 GB UFSVPU Hard Encode: H.264, H.265, 4K@60 fps; Hard Decode: H.264, H.265, VP9, AV1, AVS2, 8K@30 fps or 4K@120 fps
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Display Interface
DP TX 1 × USB/DP combo, DisplayPort v1.4, up to 4K@120 Hz, supports MST, USB Type-C with DP Alt, HDCP v2.3/v1.3EBC 1 × E-ink EPD, 2560 × 1920 hard decoding, 16-bit data bus, up to 32-level grayscaleHDMI/eDP TX 1 × HDMI v2.1 / eDP v1.3 (muxed), up to 4K@120 Hz; Supports CEC, ARC, HDCP v2.3/v1.4; eDP supports up to 3 displays with different contentMIPI DSI 1 × MIPI DSI-2 TX, D-PHY v2.0 (4 lanes) or C-PHY v1.1 (3 trios), up to 2560 × 1600@60 HzParallel 1 × Parallel RGB/BT.656/BT.1120, up to 1920 × 1080@60 Hz
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Camera Interface
DVP 1 × 8/10/12/16-bit standard DVP, up to 150 MHz data input; Supports BT.601/BT.656/BT.1120MIPI-CSI 5 × CSI-2; 4 × 2-lane D-PHY v1.2 (2.5 Gbps/lane, combinable to 2 × 4-lane); 1 × 4-lane D-PHY v2.0 (4.5 Gbps/lane) or 3 C-PHY trios; Supports up to 5 cameras working together
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Audio
Digital Audio Codec 1; Supports 2 × DAC, 3 blending modes each; Supports I2S/PCM master/slave mode, 16-bit sampling rate; Supports volume controlSAI ≤5; SAI 0/1 support 4 TX lanes + 4 RX lanes; SAI 2/3/4 support 1 TX lane + 1 RX lane; Supports I2S/TDM/PCM mode, sampling rate up to 192 kHz, 16~32 bits
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Konnektivität
CAN-FD ≤2, compliant with CAN and CAN-FD; Supports standard and extended frames; 8192-bit FIFOEthernet ≤2 × GMAC, pinout by RGMII/RMII, 10/100/1000 MbpsI2C ≤9, 7-bit and 10-bit address modes; Standard mode 100 kbps, HS mode 400 kbpsPWM ≤16, supports interrupt operation, capturing modeSDIO ≤2, SDIO v3.0, 4-bitSPI ≤5, master and slave mode, each supports two chip selectionsUART ≤12, 64-bit FIFO for TX/RX; Supports 5/6/7/8-bit serial transceiving, up to 4 Mbps; All 12 UARTs support flow control and RS485USB 2.0 OTG 2USB 3.2 2 (1 × Type-C supports DP Alt mode; 1 × combo high speed interface)
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Power
Input Power DC 5V
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Mechanisch
Abmessungen (B × T × H) 55 × 68 × 3 mmMounting Holes 4 × φ3.5 mmPackage Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
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Environment
Betriebstemperatur -40 °C ~ +85 °C
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Betriebssystem
Betriebssystem Android 14OS Flashing Method USB OTG
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Data Acquisition Protocol (DSA)
Electricity Protocol DLT645-2007, IEC101/104, DNP3.0Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPIOther Protocol BACnet, CNC
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Maintenance and Management
DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware managementLog Supports local system logs, remote logs, important log power-off preservationRemote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
Ressourcen werden abgerufen...
Standardpaket*
EC3576-C Development Board *1
* Standard package contents vary by standard order codes.
Optional accessories
Power Supply *1
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DeviceLive
IoT-Geräteverwaltungsplattform
Device management, remote monitoring, edge app management, and remote maintenance to help industrial enterprises build intelligent edge networks.
Häufig gestellte Fragen
What does the EC3576-C offer?
The EC3576-C is an AI System on Module (SoM) built on the Rockchip RK3576J SoC, designed to be integrated onto a customer-designed carrier board for industrial and commercial edge AI applications. Key specs:
| — | — |
| Compute | 4× Cortex-A72 @ 2.3 GHz + 4× Cortex-A53 @ 2.2 GHz; 6-TOPS NPU (INT4/INT8/INT16/FP16/BF16/TF32); ARM Mali-G52 MC3 GPU |
| Memory | 8 GB LPDDR4 RAM, 256 GB UFS storage |
| Betriebssystem | Android 14 (flashed via USB OTG) |
| Display | Up to 3 simultaneous displays with different content via HDMI 2.1 / eDP 1.3 / MIPI DSI-2 / Parallel / DP 1.4 / EBC (e-ink) |
| Camera | 5× MIPI CSI-2 + 1× DVP |
| Konnektivität | 2× GbE, USB 3.2, USB 2.0 OTG, CAN-FD, PCIe 2.1 |
| Form factor | 4× 100-pin board-to-board connector (0.4 mm pitch, 1.5 mm combined height) |
| Power / temp | DC 5 V; −40 to +85 °C industrial range |
Target applications per the datasheet: edge computing, intelligent terminals, industrial control, HMI, multimedia interaction, visual AI. Compatible with InHand’s DSA data-acquisition framework and DeviceLive cloud platform once deployed.
How is the EC3576-C deployed?
The EC3576-C is a module, not a standalone device — it is intended to be integrated onto a customer-designed carrier board, via four 100-pin board-to-board connectors (0.4 mm pitch, 1.5 mm combined height). Power input is DC 5 V. OS flashing is performed via USB OTG.
What carrier-board interfaces does the EC3576-C expose?
The EC3576-C exposes the following interfaces to the carrier board:
- Ethernet: up to 2× Gigabit (GMAC, RGMII/RMII)
- USB: 2× USB 3.2 (1× Type-C with USB/DP Alt, 1× combo high-speed) and 2× USB 2.0 OTG
- PCIe: PCIe 2.1
- Camera: 5× MIPI CSI-2 + 1× DVP (8/10/12/16-bit)
- Display: up to 3 simultaneous via HDMI 2.1, eDP 1.3, MIPI DSI-2, Parallel (RGB/BT.656/BT.1120), DP 1.4, EBC (e-ink, 32 grayscale)
- Industrial / serial: up to 2× CAN-FD, 12× UART (all RS-485 capable), 5× SPI, 9× I²C, 2× SDIO 3.0, 16× PWM
- Audio: up to 5× SAI/I²S + a digital audio codec (2× DAC)
How does the EC3576-C compare to the EC3588-C?
| EC3576-C | EC3588-C | |
| — | — | — |
| Betriebssystem | Android 14 | Linux |
| SoC | RK3576J | RK3588 (8 nm flagship) |
| CPU | 4× A72 + 4× A53 | 4× A76 + 4× A55 |
| GPU | Mali-G52 MC3 | Mali-G610 MP4 (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2) |
| NPU | 6 TOPS | 6 TOPS (triple-core) |
| RAM / Speicher | 8 GB LPDDR4 / 256 GB UFS | 16 GB LPDDR4 / 64 GB eMMC |
| HDMI output | up to 4K@120 Hz | up to 8K@60 Hz |
| HDMI input | — | HDMI 2.0 RX |
| PCIe | PCIe 2.1 | PCIe 3.0 (2 controllers, configurable to 1×4) + PCIe 2.0 (≤3) |
| Power input | DC 5 V | DC 4 V |
| Operating temp | −40 to +85 °C | 0 to +80 °C |
Pick the EC3576-C when the application targets Android (HMI, kiosks, multimedia/display-driven workloads), needs the wider industrial temperature range, or wants more on-board storage. Pick the EC3588-C when the application targets Linux, requires higher CPU/GPU performance, 8K output, HDMI capture, or PCIe 3.0 expansion bandwidth.