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EC3588-C
AI System on Module

EC3588-C system on module is developed based on the Rockchip RK3588 flagship ARM SoC, delivering powerful performance for high-end embedded applications.

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Lightweight Industrial AI Edge Computer

High-Performance CPU
8nm octa-core, 4×A76+4×A55 @ 2.4 GHz
Hardware acceleration
Powerful AI NPU
6.0 TOPS triple-core, multi-format acceleration
Advanced Graphics
Mali-G610 MP4, 8K@60fps codec, quad-screen output
Multi-device management
Umfangreiche Schnittstellen
PCIe 3.0, USB 3.1, SATA, GMAC, MIPI-CSI/DSI
external device integration
High-End Media
HDMI RX/TX, DP TX, multi-camera support
  • Technische Kernspezifikationen
    AI 6.0 TOPS NPU
    Cloud Platform Cloud parameter config, container management, firmware management
    Konnektivität 2×GMAC, USB 3.1, PCIe 3.0, SATA, MIPI-CSI
    CPU 4×A76 @ 2.4 GHz + 4×A55 @ 1.8 GHz
    Abmessungen (B × T × H) 68 × 60 × 4.6 mm
    Display Interface HDMI/eDP TX, DP TX, MIPI DSI, quad independent display
    Industrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MC
    Memory / Storage 16 GB LPDDR4 / 64 GB eMMC
    Betriebstemperatur 0 °C ~ +80 °C
    Betriebssystem Linux
    Remote Management InHand DeviceLive, HTTPS, SSH
    Video Codec 8K@60 fps decode, 8K@30 fps encode
  • Hardware Platform
    CPU 4 × ARM Cortex-A76 @ 2.4 GHz + 4 × ARM Cortex-A55 @ 1.8 GHz
    GPU ARM Mali-G610 MP4, OpenGLES 1.1/2.0/3.2, OpenCL 2.2, Vulkan 1.2
    NPU 6.0 TOPS, triple core, supports int4/int8/int16/FP16/BF16/TF32 acceleration
    RAM 16 GB LPDDR4
    ROM 64 GB eMMC
    VPU Decode: H.265/VP9 up to 8K@60 fps, H.264 up to 8K@30 fps, AV1 up to 4K@60 fps; Encode: H.265/HEVC, H.264/AVC up to 8K@30 fps
  • Video Input
    DVP 1; 8/10/12/16-bit standard DVP up to 150 MHz; Supports BT.601/BT.656/BT.1120
    HDMI RX 1; Supports HDMI 2.0 (3.4~6 Gbps) and HDMI 1.4b (250Mbps~3.4 Gbps); HDCP2.3 and HDCP1.4
    MIPI CSI DPHY 4; 2-lane MIPI DPHY V1.2 (2.5 Gsps/lane); Two 2-lane can be combined to 4-lane
    MIPI DCPHY 2; Supports DPHY or CPHY; 4-lane MIPI DPHY V2.0 (4.5 Gbps/lane); 3-lane MIPI CPHY V1.1 (2.5 Gsps/lane); Supports multiple MIPI-CSI combos
  • Video Output
    BT.1120 1; RGB up to 8-bit up to 150 MHz; Up to 1920 × 1080@60 Hz
    DP TX 2; DP TX 1.4a, available for USB3.1 Gen 1, supports 1/2/4 lanes; Up to 8192 × 4320@30 Hz; HDCP2.3, HDCP1.3
    HDMI/eDP TX ≤2; HDMI up to 7680 × 4320@60 Hz (3/6/8/10/12 Gbps), HDCP2.3; eDP up to 4K@60 Hz (1.62/2.7/5.4 Gbps), HDCP1.3
    MIPI DSI 2; MIPI DPHY 2.0 or CPHY 1.1, up to 4K@60 Hz; Dual MIPI-DSI left/right mode, RGB/YUV up to 10-bit
  • Audio
    DSM PWM 1; Convert PCM to bitstream digital 1-bit output
    I2S ≤4; I2S0/I2S1: 8 lanes, TX/RX, 16-32 bits, up to 192 kHz; I2S2/I2S3: 2 lanes, TX/RX, 16~32 bits, up to 192 kHz
    PDM 2; Up to 8 channels, 16~24 bits, up to 192 kHz; PDM primary receive mode
    SPDIF 2; 2× 16-bit data storing; Biphasic stereo output
  • Konnektivität
    ADC ≤8; 8 × 12-bit single-end input SAR-ADC, up to 1 MS/s
    Ethernet 2 × GMAC by RGMII/RMII, 10/100/1000 Mbps
    I2C ≤9; 7-bit and 10-bit address modes; Standard mode up to 100 kbps, high-speed mode up to 400 kbps
    PCIe 2.0 ≤3; Each supports 1 lane, up to 5 Gbps
    PCIe 3.0 2; Supports RC and EP, up to 8 Gbps; Combinations: 1×4, 2×2, 4×1, 1×2+2×1
    PWM ≤16; Supports capturing mode
    SATA ≤3; 3 × SATA3.0 controllers, multiplexed by PCIe and USB_HOST2; Supports eSATA up to 6 Gbps
    SPI ≤5; Each controller supports two chip select outputs; Master and slave mode configurable
    UART ≤10; 2 × 64-bit FIFO for TX/RX; 5/6/7/8-bit serial, up to 4 Mbps; All 10 UARTs support auto flow control
    USB 2.0 Host 2
    USB 3.1 Gen 1 3; Up to 5 Gbps; 2 × USB3.1 OTG (multiplexed with DP TX, supports USB Type-C and DP Alt); 1 × USB3.1 Host (multiplexed with PIPE PHY2)
  • Power
    Input Power DC 4V
  • Mechanisch
    Abmessungen (B × T × H) 68 × 60 × 4.6 mm
    Mounting Holes 4 × φ2.5 mm
    Package Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
  • Environment
    Betriebstemperatur 0 °C ~ +80 °C
  • Betriebssystem
    Betriebssystem Linux
    OS Flashing Method USB OTG
  • Data Acquisition Protocol (DSA)
    Electricity Protocol DLT645-2007, IEC101/104, DNP3.0
    Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPI
    Other Protocol BACnet, CNC
  • Maintenance and Management
    DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware management
    Log Supports local system logs, remote logs, important log power-off preservation
    Remote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.
    Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
Ressourcen werden abgerufen...

Standardpaket*

EC3588-C Development Board *1

* Standard package contents vary by standard order codes.

Optional accessories

Power Supply *1

Kontaktieren Sie uns Um mehr über unsere Verpackungsoptionen zu erfahren, wenden Sie sich bitte direkt an uns.

DeviceLive

IoT-Geräteverwaltungsplattform

Device management, remote monitoring, edge app management, and remote maintenance to help industrial enterprises build intelligent edge networks.

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Häufig gestellte Fragen

What does the EC3588-C offer?

The EC3588-C is a high-end AI System on Module (SoM) built on the flagship Rockchip RK3588 SoC for demanding edge AI and multimedia applications. Key specs:

——
Compute4× Cortex-A76 @ 2.4 GHz + 4× Cortex-A55 @ 1.8 GHz (8 nm); 6-TOPS triple-core NPU (INT4/INT8/INT16/FP16/BF16/TF32); Mali-G610 MP4 GPU (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)
Memory16 GB LPDDR4 (2× 8 GB), 64 GB eMMC
BetriebssystemLinux (flashed via USB OTG)
Video outputUp to 2× HDMI 2.0 / eDP — HDMI to 8K@60 Hz; 2× DisplayPort 1.4a (up to 8K@30 Hz); 2× MIPI DSI; BT.1120
Video input1× HDMI 2.0 RX; 4× MIPI CSI D-PHY; 2× MIPI DC PHY (D-PHY/C-PHY); 1× DVP
Konnektivität2× GbE, 3× USB 3.1 Gen 1, 2× USB 2.0, 2× PCIe 3.0 controllers (up to 1×4), ≤3× PCIe 2.0, ≤3× SATA 3.0
Form factor4× 100-pin board-to-board connector (0.4 mm pitch, 1.5 mm combined height)
Power / tempDC 4 V; 0 to +80 °C

Target applications per the datasheet: industrial IoT, edge AI, in-vehicle systems, smart displays, AIoT, high-end embedded. Compatible with InHand’s DSA data-acquisition framework and DeviceLive cloud platform once deployed.

The EC3588-C is a module designed for integration onto a customer carrier board (it is not a standalone device), via four 100-pin board-to-board connectors (0.4 mm pitch, 1.5 mm combined height). Power input is DC 4 V. OS flashing is performed via USB OTG.

The EC3588-C exposes the following interfaces to the carrier board:

  • Ethernet: 2× Gigabit (GMAC, RGMII/RMII)
  • USB: 3× USB 3.1 Gen 1 (2× OTG with DP Alt via Type-C, 1× Host) and 2× USB 2.0 Host
  • PCIe / SATA: 2× PCIe 3.0 controllers (configurable as 1×4, 2×2, 4×1, or 1×2 + 2×1; up to 8 Gbps), ≤3× PCIe 2.0 lanes (up to 5 Gbps), ≤3× SATA 3.0 (up to 6 Gbps; multiplexed with PCIe/USB)
  • Video input: 1× HDMI 2.0 RX (HDCP 2.3 / 1.4), 4× MIPI CSI D-PHY, 2× MIPI DC PHY (D-PHY/C-PHY), 1× DVP
  • Video output: up to 2× HDMI/eDP (HDMI 8K@60 Hz), 2× DP 1.4a (up to 8K@30 Hz), 2× MIPI DSI (up to 4K@60 Hz)
  • Industrial / serial: ≤10× UART, ≤5× SPI, ≤9× I²C, ≤16× PWM, ≤8× ADC (12-bit)
  • Audio: ≤4× I²S, 2× SPDIF, 2× PDM, 1× DSM PWM
EC3588-CEC3576-C
———
BetriebssystemLinuxAndroid 14
SoCRK3588 (8 nm flagship)RK3576J
CPU4× A76 + 4× A554× A72 + 4× A53
GPUMali-G610 MP4 (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)Mali-G52 MC3
NPU6 TOPS (triple-core)6 TOPS
RAM / Speicher16 GB LPDDR4 / 64 GB eMMC8 GB LPDDR4 / 256 GB UFS
HDMI outputup to 8K@60 Hzup to 4K@120 Hz
HDMI inputHDMI 2.0 RX—
PCIePCIe 3.0 (2 controllers, configurable to 1×4) + PCIe 2.0 (≤3)PCIe 2.1
Power inputDC 4 VDC 5 V
Operating temp0 to +80 °C−40 to +85 °C

Pick the EC3588-C when the application targets Linux, requires higher CPU/GPU performance, 8K output, HDMI capture, or PCIe 3.0 expansion bandwidth. Pick the EC3576-C when the application targets Android (HMI, kiosks, multimedia/display-driven workloads), needs the wider industrial temperature range, or wants more on-board storage.

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