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EC3588-C
AI System on Module

EC3588-C system on module is developed based on the Rockchip RK3588 flagship ARM SoC, delivering powerful performance for high-end embedded applications.

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Lightweight Industrial AI Edge Computer

High-Performance CPU
8nm octa-core, 4×A76+4×A55 @ 2.4 GHz
Hardware acceleration
Powerful AI NPU
6.0 TOPS triple-core, multi-format acceleration
Advanced Graphics
Mali-G610 MP4, 8K@60fps codec, quad-screen output
Multi-device management
Interfaces riches
PCIe 3.0, USB 3.1, SATA, GMAC, MIPI-CSI/DSI
external device integration
High-End Media
HDMI RX/TX, DP TX, multi-camera support
  • Core Technical Specifications
    AI 6.0 TOPS NPU
    Cloud Platform Cloud parameter config, container management, firmware management
    Connectivité 2×GMAC, USB 3.1, PCIe 3.0, SATA, MIPI-CSI
    CPU 4×A76 @ 2.4 GHz + 4×A55 @ 1.8 GHz
    Dimensions (W × D × H) 68 × 60 × 4.6 mm
    Display Interface HDMI/eDP TX, DP TX, MIPI DSI, quad independent display
    Industrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MC
    Memory / Storage 16 GB LPDDR4 / 64 GB eMMC
    Operating Temperature 0 °C ~ +80 °C
    OS Linux
    Remote Management InHand DeviceLive, HTTPS, SSH
    Video Codec 8K@60 fps decode, 8K@30 fps encode
  • Hardware Platform
    CPU 4 × ARM Cortex-A76 @ 2.4 GHz + 4 × ARM Cortex-A55 @ 1.8 GHz
    GPU ARM Mali-G610 MP4, OpenGLES 1.1/2.0/3.2, OpenCL 2.2, Vulkan 1.2
    NPU 6.0 TOPS, triple core, supports int4/int8/int16/FP16/BF16/TF32 acceleration
    RAM 16 GB LPDDR4
    ROM 64 GB eMMC
    VPU Decode: H.265/VP9 up to 8K@60 fps, H.264 up to 8K@30 fps, AV1 up to 4K@60 fps; Encode: H.265/HEVC, H.264/AVC up to 8K@30 fps
  • Video Input
    DVP 1; 8/10/12/16-bit standard DVP up to 150 MHz; Supports BT.601/BT.656/BT.1120
    HDMI RX 1; Supports HDMI 2.0 (3.4~6 Gbps) and HDMI 1.4b (250Mbps~3.4 Gbps); HDCP2.3 and HDCP1.4
    MIPI CSI DPHY 4; 2-lane MIPI DPHY V1.2 (2.5 Gsps/lane); Two 2-lane can be combined to 4-lane
    MIPI DCPHY 2; Supports DPHY or CPHY; 4-lane MIPI DPHY V2.0 (4.5 Gbps/lane); 3-lane MIPI CPHY V1.1 (2.5 Gsps/lane); Supports multiple MIPI-CSI combos
  • Video Output
    BT.1120 1; RGB up to 8-bit up to 150 MHz; Up to 1920 × 1080@60 Hz
    DP TX 2; DP TX 1.4a, available for USB3.1 Gen 1, supports 1/2/4 lanes; Up to 8192 × 4320@30 Hz; HDCP2.3, HDCP1.3
    HDMI/eDP TX ≤2; HDMI up to 7680 × 4320@60 Hz (3/6/8/10/12 Gbps), HDCP2.3; eDP up to 4K@60 Hz (1.62/2.7/5.4 Gbps), HDCP1.3
    MIPI DSI 2; MIPI DPHY 2.0 or CPHY 1.1, up to 4K@60 Hz; Dual MIPI-DSI left/right mode, RGB/YUV up to 10-bit
  • Audio
    DSM PWM 1; Convert PCM to bitstream digital 1-bit output
    I2S ≤4; I2S0/I2S1: 8 lanes, TX/RX, 16-32 bits, up to 192 kHz; I2S2/I2S3: 2 lanes, TX/RX, 16~32 bits, up to 192 kHz
    PDM 2; Up to 8 channels, 16~24 bits, up to 192 kHz; PDM primary receive mode
    SPDIF 2; 2× 16-bit data storing; Biphasic stereo output
  • Connectivité
    ADC ≤8; 8 × 12-bit single-end input SAR-ADC, up to 1 MS/s
    Ethernet 2 × GMAC by RGMII/RMII, 10/100/1000 Mbps
    I2C ≤9; 7-bit and 10-bit address modes; Standard mode up to 100 kbps, high-speed mode up to 400 kbps
    PCIe 2.0 ≤3; Each supports 1 lane, up to 5 Gbps
    PCIe 3.0 2; Supports RC and EP, up to 8 Gbps; Combinations: 1×4, 2×2, 4×1, 1×2+2×1
    PWM ≤16; Supports capturing mode
    SATA ≤3; 3 × SATA3.0 controllers, multiplexed by PCIe and USB_HOST2; Supports eSATA up to 6 Gbps
    SPI ≤5; Each controller supports two chip select outputs; Master and slave mode configurable
    UART ≤10; 2 × 64-bit FIFO for TX/RX; 5/6/7/8-bit serial, up to 4 Mbps; All 10 UARTs support auto flow control
    USB 2.0 Host 2
    USB 3.1 Gen 1 3; Up to 5 Gbps; 2 × USB3.1 OTG (multiplexed with DP TX, supports USB Type-C and DP Alt); 1 × USB3.1 Host (multiplexed with PIPE PHY2)
  • Power
    Input Power DC 4V
  • Mechanical
    Dimensions (W × D × H) 68 × 60 × 4.6 mm
    Mounting Holes 4 × φ2.5 mm
    Package Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
  • Environment
    Operating Temperature 0 °C ~ +80 °C
  • Operating System
    OS Linux
    OS Flashing Method USB OTG
  • Data Acquisition Protocol (DSA)
    Electricity Protocol DLT645-2007, IEC101/104, DNP3.0
    Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPI
    Other Protocol BACnet, CNC
  • Maintenance and Management
    DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware management
    Log Supports local system logs, remote logs, important log power-off preservation
    Remote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.
    Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
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Standard package*

EC3588-C Development Board *1

* Standard package contents vary by standard order codes.

Optional accessories

Power Supply *1

Contact us directly to learn more about our packaging options.

DeviceLive

Plateforme de gestion des appareils IoT

Device management, remote monitoring, edge app management, and remote maintenance to help industrial enterprises build intelligent edge networks.

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Frequently Asked Questions

What does the EC3588-C offer?

The EC3588-C is a high-end AI System on Module (SoM) built on the flagship Rockchip RK3588 SoC for demanding edge AI and multimedia applications. Key specs:

——
Compute4× Cortex-A76 @ 2.4 GHz + 4× Cortex-A55 @ 1.8 GHz (8 nm); 6-TOPS triple-core NPU (INT4/INT8/INT16/FP16/BF16/TF32); Mali-G610 MP4 GPU (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)
Memory16 GB LPDDR4 (2× 8 GB), 64 GB eMMC
OSLinux (flashed via USB OTG)
Video outputUp to 2× HDMI 2.0 / eDP — HDMI to 8K@60 Hz; 2× DisplayPort 1.4a (up to 8K@30 Hz); 2× MIPI DSI; BT.1120
Video input1× HDMI 2.0 RX; 4× MIPI CSI D-PHY; 2× MIPI DC PHY (D-PHY/C-PHY); 1× DVP
Connectivité2× GbE, 3× USB 3.1 Gen 1, 2× USB 2.0, 2× PCIe 3.0 controllers (up to 1×4), ≤3× PCIe 2.0, ≤3× SATA 3.0
Form factor4× 100-pin board-to-board connector (0.4 mm pitch, 1.5 mm combined height)
Power / tempDC 4 V; 0 to +80 °C

Target applications per the datasheet: industrial IoT, edge AI, in-vehicle systems, smart displays, AIoT, high-end embedded. Compatible with InHand’s DSA data-acquisition framework and DeviceLive cloud platform once deployed.

The EC3588-C is a module designed for integration onto a customer carrier board (it is not a standalone device), via four 100-pin board-to-board connectors (0.4 mm pitch, 1.5 mm combined height). Power input is DC 4 V. OS flashing is performed via USB OTG.

The EC3588-C exposes the following interfaces to the carrier board:

  • Ethernet: 2× Gigabit (GMAC, RGMII/RMII)
  • USB: 3× USB 3.1 Gen 1 (2× OTG with DP Alt via Type-C, 1× Host) and 2× USB 2.0 Host
  • PCIe / SATA: 2× PCIe 3.0 controllers (configurable as 1×4, 2×2, 4×1, or 1×2 + 2×1; up to 8 Gbps), ≤3× PCIe 2.0 lanes (up to 5 Gbps), ≤3× SATA 3.0 (up to 6 Gbps; multiplexed with PCIe/USB)
  • Video input: 1× HDMI 2.0 RX (HDCP 2.3 / 1.4), 4× MIPI CSI D-PHY, 2× MIPI DC PHY (D-PHY/C-PHY), 1× DVP
  • Video output: up to 2× HDMI/eDP (HDMI 8K@60 Hz), 2× DP 1.4a (up to 8K@30 Hz), 2× MIPI DSI (up to 4K@60 Hz)
  • Industrial / serial: ≤10× UART, ≤5× SPI, ≤9× I²C, ≤16× PWM, ≤8× ADC (12-bit)
  • Audio: ≤4× I²S, 2× SPDIF, 2× PDM, 1× DSM PWM
EC3588-CEC3576-C
———
OSLinuxAndroid 14
SoCRK3588 (8 nm flagship)RK3576J
CPU4× A76 + 4× A554× A72 + 4× A53
GPUMali-G610 MP4 (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)Mali-G52 MC3
NPU6 TOPS (triple-core)6 TOPS
RAM / Storage16 GB LPDDR4 / 64 GB eMMC8 GB LPDDR4 / 256 GB UFS
HDMI outputup to 8K@60 Hzup to 4K@120 Hz
HDMI inputHDMI 2.0 RX—
PCIePCIe 3.0 (2 controllers, configurable to 1×4) + PCIe 2.0 (≤3)PCIe 2.1
Power inputDC 4 VDC 5 V
Operating temp0 to +80 °C−40 to +85 °C

Pick the EC3588-C when the application targets Linux, requires higher CPU/GPU performance, 8K output, HDMI capture, or PCIe 3.0 expansion bandwidth. Pick the EC3576-C when the application targets Android (HMI, kiosks, multimedia/display-driven workloads), needs the wider industrial temperature range, or wants more on-board storage.

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