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EC3576-C
AI System on Module

EC3576-C system on module is powered by the Rockchip RK3576 processor, tailored for AIoT and industrial markets.

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EC3576-C
AI System on Module

EC3576-C system on module is powered by the Rockchip RK3576 processor, tailored for AIoT and industrial markets.

Request a Quote

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Lightweight Industrial AI Edge Computer

High-Performance CPU
8nm octa-core, 4×A72+4×A53 @ 2.3 GHz
Hardware acceleration
Powerful AI NPU
6.0 TOPS INT8, multi-format support
Advanced Graphics
Mali-G52 MC3, 8K codec, triple display
Industrial grade component
Rich Interfaces
PCIe, USB 3.2, CAN-FD, GMAC, MIPI
Outdoor durability icon
Industrial Grade
-40 °C ~ +85 °C, ultra-thin connector
  • Core Technical Specifications
    OS Android 14
    Industrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MC
    Remote Management InHand DeviceLive, HTTPS, SSH
    AI 6.0 TOPS INT8 NPU
    Video Codec 8K@30 fps decode, 4K@60 fps encode
    Cloud Platform Cloud parameter config, container management, firmware management
    CPU 4×A72 @ 2.3 GHz + 4×A53 @ 2.2 GHz
    Memory / Storage 8 GB LPDDR4 / 256 GB UFS
    Display Interface HDMI/eDP/DSI/DP, triple independent display
    Connectivity 2×GMAC, USB 3.2, CAN-FD, MIPI-CSI×5, UART×12
    Dimensions (W × D × H) 55 × 68 × 3 mm (2.17 × 2.68 × 0.12 in)
    Operating Temperature -40 °C ~ +85 °C (-40 °F ~ +185 °F)
  • Hardware Platform
    CPU 4 × ARM Cortex-A72 @ 2.3 GHz + 4 × ARM Cortex-A53 @ 2.2 GHz
    NPU 6.0 TOPS INT8, supports INT4/INT8/INT16/FP16/BF16/TF32
    GPU ARM Mali-G52 MC3
    VPU Hard Encode: H.264, H.265, 4K@60 fps; Hard Decode: H.264, H.265, VP9, AV1, AVS2, 8K@30 fps or 4K@120 fps
    RAM 8 GB LPDDR4
    ROM 256 GB UFS
  • Display Interface
    HDMI/eDP TX 1 × HDMI v2.1 / eDP v1.3 (muxed), up to 4K@120 Hz; Supports CEC, ARC, HDCP v2.3/v1.4; eDP supports up to 3 displays with different content
    MIPI DSI 1 × MIPI DSI-2 TX, D-PHY v2.0 (4 lanes) or C-PHY v1.1 (3 trios), up to 2560 × 1600@60 Hz
    Parallel 1 × Parallel RGB/BT.656/BT.1120, up to 1920 × 1080@60 Hz
    EBC 1 × E-ink EPD, 2560 × 1920 hard decoding, 16-bit data bus, up to 32-level grayscale
    DP TX 1 × USB/DP combo, DisplayPort v1.4, up to 4K@120 Hz, supports MST, USB Type-C with DP Alt, HDCP v2.3/v1.3
  • Camera Interface
    MIPI-CSI 5 × CSI-2; 4 × 2-lane D-PHY v1.2 (2.5 Gbps/lane, combinable to 2 × 4-lane); 1 × 4-lane D-PHY v2.0 (4.5 Gbps/lane) or 3 C-PHY trios; Supports up to 5 cameras working together
    DVP 1 × 8/10/12/16-bit standard DVP, up to 150 MHz data input; Supports BT.601/BT.656/BT.1120
  • Audio
    SAI ≤5; SAI 0/1 support 4 TX lanes + 4 RX lanes; SAI 2/3/4 support 1 TX lane + 1 RX lane; Supports I2S/TDM/PCM mode, sampling rate up to 192 kHz, 16~32 bits
    Digital Audio Codec 1; Supports 2 × DAC, 3 blending modes each; Supports I2S/PCM master/slave mode, 16-bit sampling rate; Supports volume control
  • Connectivity
    Ethernet ≤2 × GMAC, pinout by RGMII/RMII, 10/100/1000 Mbps
    SDIO ≤2, SDIO v3.0, 4-bit
    USB 3.2 2 (1 × Type-C supports DP Alt mode; 1 × combo high speed interface)
    USB 2.0 OTG 2
    UART ≤12, 64-bit FIFO for TX/RX; Supports 5/6/7/8-bit serial transceiving, up to 4 Mbps; All 12 UARTs support flow control and RS-485
    CAN-FD ≤2, compliant with CAN and CAN-FD; Supports standard and extended frames; 8192-bit FIFO
    SPI ≤5, master and slave mode, each supports two chip selections
    I2C ≤9, 7-bit and 10-bit address modes; Standard mode 100 kbps, HS mode 400 kbps
    PWM ≤16, supports interrupt operation, capturing mode
  • Power
    Input Power DC 5V
  • Mechanical
    Dimensions (W × D × H) 55 × 68 × 3 mm (2.17 × 2.68 × 0.12 in)
    Package Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
    Mounting Holes 4 × φ3.5 mm
  • Environment
    Operating Temperature -40 °C ~ +85 °C (-40 °F ~ +185 °F)
  • Operating System
    OS Android 14
    OS Flashing Method USB OTG
  • Data Acquisition Protocol (DSA)
    Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPI
    Electricity Protocol DLT645-2007, IEC101/104, DNP3.0
    Other Protocol BACnet, CNC
  • Maintenance and Management
    Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
    Log Supports local system logs, remote logs, important log power-off preservation
    Remote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.
    DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware management
Fetching resources...

Standard package*

EC3576-C Development Board *1

* Standard package contents vary by standard order codes.

Optional accessories

Power Supply *1

Contact us directly to learn more about our packaging options.

Specifications
  • Core Technical Specifications
    OS Android 14
    Industrial Protocol Modbus RTU/TCP, EtherNet/IP, OPC UA, Mitsubishi MC
    Remote Management InHand DeviceLive, HTTPS, SSH
    AI 6.0 TOPS INT8 NPU
    Video Codec 8K@30 fps decode, 4K@60 fps encode
    Cloud Platform Cloud parameter config, container management, firmware management
    CPU 4×A72 @ 2.3 GHz + 4×A53 @ 2.2 GHz
    Memory / Storage 8 GB LPDDR4 / 256 GB UFS
    Display Interface HDMI/eDP/DSI/DP, triple independent display
    Connectivity 2×GMAC, USB 3.2, CAN-FD, MIPI-CSI×5, UART×12
    Dimensions (W × D × H) 55 × 68 × 3 mm (2.17 × 2.68 × 0.12 in)
    Operating Temperature -40 °C ~ +85 °C (-40 °F ~ +185 °F)
  • Hardware Platform
    CPU 4 × ARM Cortex-A72 @ 2.3 GHz + 4 × ARM Cortex-A53 @ 2.2 GHz
    NPU 6.0 TOPS INT8, supports INT4/INT8/INT16/FP16/BF16/TF32
    GPU ARM Mali-G52 MC3
    VPU Hard Encode: H.264, H.265, 4K@60 fps; Hard Decode: H.264, H.265, VP9, AV1, AVS2, 8K@30 fps or 4K@120 fps
    RAM 8 GB LPDDR4
    ROM 256 GB UFS
  • Display Interface
    HDMI/eDP TX 1 × HDMI v2.1 / eDP v1.3 (muxed), up to 4K@120 Hz; Supports CEC, ARC, HDCP v2.3/v1.4; eDP supports up to 3 displays with different content
    MIPI DSI 1 × MIPI DSI-2 TX, D-PHY v2.0 (4 lanes) or C-PHY v1.1 (3 trios), up to 2560 × 1600@60 Hz
    Parallel 1 × Parallel RGB/BT.656/BT.1120, up to 1920 × 1080@60 Hz
    EBC 1 × E-ink EPD, 2560 × 1920 hard decoding, 16-bit data bus, up to 32-level grayscale
    DP TX 1 × USB/DP combo, DisplayPort v1.4, up to 4K@120 Hz, supports MST, USB Type-C with DP Alt, HDCP v2.3/v1.3
  • Camera Interface
    MIPI-CSI 5 × CSI-2; 4 × 2-lane D-PHY v1.2 (2.5 Gbps/lane, combinable to 2 × 4-lane); 1 × 4-lane D-PHY v2.0 (4.5 Gbps/lane) or 3 C-PHY trios; Supports up to 5 cameras working together
    DVP 1 × 8/10/12/16-bit standard DVP, up to 150 MHz data input; Supports BT.601/BT.656/BT.1120
  • Audio
    SAI ≤5; SAI 0/1 support 4 TX lanes + 4 RX lanes; SAI 2/3/4 support 1 TX lane + 1 RX lane; Supports I2S/TDM/PCM mode, sampling rate up to 192 kHz, 16~32 bits
    Digital Audio Codec 1; Supports 2 × DAC, 3 blending modes each; Supports I2S/PCM master/slave mode, 16-bit sampling rate; Supports volume control
  • Connectivity
    Ethernet ≤2 × GMAC, pinout by RGMII/RMII, 10/100/1000 Mbps
    SDIO ≤2, SDIO v3.0, 4-bit
    USB 3.2 2 (1 × Type-C supports DP Alt mode; 1 × combo high speed interface)
    USB 2.0 OTG 2
    UART ≤12, 64-bit FIFO for TX/RX; Supports 5/6/7/8-bit serial transceiving, up to 4 Mbps; All 12 UARTs support flow control and RS-485
    CAN-FD ≤2, compliant with CAN and CAN-FD; Supports standard and extended frames; 8192-bit FIFO
    SPI ≤5, master and slave mode, each supports two chip selections
    I2C ≤9, 7-bit and 10-bit address modes; Standard mode 100 kbps, HS mode 400 kbps
    PWM ≤16, supports interrupt operation, capturing mode
  • Power
    Input Power DC 5V
  • Mechanical
    Dimensions (W × D × H) 55 × 68 × 3 mm (2.17 × 2.68 × 0.12 in)
    Package Board-to-board connector (4 × 100-pin, 0.4 mm pitch, combined height 1.5 mm)
    Mounting Holes 4 × φ3.5 mm
  • Environment
    Operating Temperature -40 °C ~ +85 °C (-40 °F ~ +185 °F)
  • Operating System
    OS Android 14
    OS Flashing Method USB OTG
  • Data Acquisition Protocol (DSA)
    Industrial Protocol Modbus RTU Master/Slave, Modbus TCP Master/Slave, EtherNet/IP, ISO on TCP, OPC UA Client/Server, Mitsubishi MC 3C/3E/3C OverTCP, Mitsubishi CPU Port, FINS UDP, Host Link, PPI
    Electricity Protocol DLT645-2007, IEC101/104, DNP3.0
    Other Protocol BACnet, CNC
  • Maintenance and Management
    Upgrade Method Supports patent upgrade mechanism, local or remote firmware upgrade
    Log Supports local system logs, remote logs, important log power-off preservation
    Remote Management InHand DeviceLive, HTTP, HTTPS, SSH, etc.
    DeviceLive Cloud Supports cloud-based parameter configuration, container management, application and firmware management
Fetching resources...

Standard package*

EC3576-C Development Board *1

* Standard package contents vary by standard order codes.

Optional accessories

Power Supply *1

Contact us directly to learn more about our packaging options.

DeviceLive

IoT Device Management Platform

Device management, remote monitoring, edge app management, and remote maintenance to help industrial enterprises build intelligent edge networks.

Learn More

DeviceLive

Learn More

Frequently Asked Questions

What does the EC3576-C offer?

The EC3576-C is an AI System on Module (SoM) built on the Rockchip RK3576J SoC, designed to be integrated onto a customer-designed carrier board for industrial and commercial edge AI applications. Key specs:

——
Compute4× Cortex-A72 @ 2.3 GHz + 4× Cortex-A53 @ 2.2 GHz; 6-TOPS NPU (INT4/INT8/INT16/FP16/BF16/TF32); ARM Mali-G52 MC3 GPU
Memory8 GB LPDDR4 RAM, 256 GB UFS storage
OSAndroid 14 (flashed via USB OTG)
DisplayUp to 3 simultaneous displays with different content via HDMI 2.1 / eDP 1.3 / MIPI DSI-2 / Parallel / DP 1.4 / EBC (e-ink)
Camera5× MIPI CSI-2 + 1× DVP
Connectivity2× GbE, USB 3.2, USB 2.0 OTG, CAN-FD, PCIe 2.1
Form factor4× 100-pin board-to-board connector (0.4 mm pitch, 1.5 mm combined height)
Power / tempDC 5 V; −40 to +85 °C industrial range

Target applications per the datasheet: edge computing, intelligent terminals, industrial control, HMI, multimedia interaction, visual AI. Compatible with InHand’s DSA data-acquisition framework and DeviceLive cloud platform once deployed.

The EC3576-C is a module, not a standalone device — it is intended to be integrated onto a customer-designed carrier board, via four 100-pin board-to-board connectors (0.4 mm pitch, 1.5 mm combined height). Power input is DC 5 V. OS flashing is performed via USB OTG.

The EC3576-C exposes the following interfaces to the carrier board:

  • Ethernet: up to 2× Gigabit (GMAC, RGMII/RMII)
  • USB: 2× USB 3.2 (1× Type-C with USB/DP Alt, 1× combo high-speed) and 2× USB 2.0 OTG
  • PCIe: PCIe 2.1
  • Camera: 5× MIPI CSI-2 + 1× DVP (8/10/12/16-bit)
  • Display: up to 3 simultaneous via HDMI 2.1, eDP 1.3, MIPI DSI-2, Parallel (RGB/BT.656/BT.1120), DP 1.4, EBC (e-ink, 32 grayscale)
  • Industrial / serial: up to 2× CAN-FD, 12× UART (all RS-485 capable), 5× SPI, 9× I²C, 2× SDIO 3.0, 16× PWM
  • Audio: up to 5× SAI/I²S + a digital audio codec (2× DAC)
EC3576-CEC3588-C
———
OSAndroid 14Linux
SoCRK3576JRK3588 (8 nm flagship)
CPU4× A72 + 4× A534× A76 + 4× A55
GPUMali-G52 MC3Mali-G610 MP4 (OpenGL ES 3.2, OpenCL 2.2, Vulkan 1.2)
NPU6 TOPS6 TOPS (triple-core)
RAM / Storage8 GB LPDDR4 / 256 GB UFS16 GB LPDDR4 / 64 GB eMMC
HDMI outputup to 4K@120 Hzup to 8K@60 Hz
HDMI input—HDMI 2.0 RX
PCIePCIe 2.1PCIe 3.0 (2 controllers, configurable to 1×4) + PCIe 2.0 (≤3)
Power inputDC 5 VDC 4 V
Operating temp−40 to +85 °C0 to +80 °C

Pick the EC3576-C when the application targets Android (HMI, kiosks, multimedia/display-driven workloads), needs the wider industrial temperature range, or wants more on-board storage. Pick the EC3588-C when the application targets Linux, requires higher CPU/GPU performance, 8K output, HDMI capture, or PCIe 3.0 expansion bandwidth.

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